* Glass Passivated Die Construction
* Ideally Suited for Automatic Assembly
* Low Forward Overload Drop, High Efficiency
* Low Power Loss
* Super-Fast.

of information, products or circuits described in the datasheets. 4- In no event shall SMC - Sangdest Microelectronics (.

ES1

ES100

ES1000

ES1000FL

ES1001-7R

ES1001FL

ES1001FL-AU

ES1002FL

ES1002FL-AU

ES1003FL

ES1004FL

ES1004FL-AU

ES1006FL

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