PC123XNYFZ0F Features
* 1. 4-pin DIP package 2. Double transfer mold package (Ideal for Flow Solder- ing) 3. Current transfer ratio (CTR : MIN. 50% at IF=5 mA, VCE=5V) 4. Several CTR ranks available 5. Reinforced insulation type (Isolation distance : MIN. 0.4mm) 6. Long creepage distance type (wide lead-form type only : MI
Datasheet Details
PC123XNYFZ0F, PC123XNNSZ0F
SHARP
289.31 KB
Photocoupler.
This datasheet PDF includes multiple part numbers: PC123XNYFZ0F, PC123XNNSZ0F.
Please refer to the document for exact specifications by model.
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PC123XNYFZ0F Distributor
