PC123X2NFZ0F
Description
PC123XNNSZ0F Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-pin DIP, available in wide-lead spacing option and SMT gullwing lead-form option.
Key Features
- Double transfer mold package (Ideal for Flow Solder- ing)
- Current transfer ratio (CTR : MIN. 50% at IF=5 mA, VCE=5V)
- Several CTR ranks available
- Reinforced insulation type (Isolation distance : MIN. 0.4mm)
- Long creepage distance type (wide lead-form type only : MIN. 8mm)
- High isolation voltage between input and output (Viso(rms) : 5kV)
- RoHS directive compliant
- Agency approvals/pliance
- Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC123)
- Approved by BSI, BS-EN60065, file No. 7087, BSEN60950 file No. 7409, (as model
