1) Signal amplifier is built into the image sensor IC in order to increase immunity to external noise. 2) Employing low voltage driving sensor enables 3.3V drive which is identical to the ASIC. 3) The LED light source is mounted on the same substrate as the sensor chip which allows packaging of the device with lighter weight and smaller size. 4) With the proprietary prism, the output signal is maintained uniformly. 5) The ceramic substrate is used for excellent dimensional accuracy and thermal s.