* Emboss Taping Reel Pack.
* Ultra small Flat Lead Package (UFP) is suitable for surface mount design. Ordering Information Part No. RKZ-KJ Series Laser Mark Le.

RKZ2.7B2KG

RKZ2.7B2KK

RKZ2.7B2KL

RKZ2.7BKU

RKZ2.7AKU

RKZ2.0BKG

RKZ2.0BKJ

RKZ2.0BKK

RKZ2.0BKL

RKZ2.2BKG

RKZ2.2BKJ

RKZ2.2BKK

RKZ2.2BKL

Since 2006. D4U Semicon.   |   Contact Us   |   Privacy Policy   |   Purchase of parts