Absolute Maximum Ratings
Stresses above the ratings listed below (Table 1 and Table 2) can cause permanent damage to the P9025AC. These ratings,
which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these
or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the
recommended operating temperature range.
Table 1: Absolute Maximum Ratings Summary
AC1, AC2, VRECT, ACM1, ACM2, CLAMP1, CLAMP2 to PGND_
BST1, BST2 to PGND1
INT, EN, STAT, SCL, SDA, OUT, SNS, TEOP, RLIM, CHG_END/CS100, FOD1, FOD2, VDD to AGND
PGND, PGND1, PGND2, to AGND
AC1, AC2 Current
-0.3 to 20
-0.3 to (AC1, AC2 + 6)
-0.3 to 6
-0.3 to 0.3
Table 2: Package Thermal Information1,2,3,4
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Thermal Resistance Junction to Board
Operating Junction Temperature
Ambient Operating Temperature
Lead Temperature (soldering, 10s)
0 to +125
0 to +85
-55 to +150
1. The maximum power dissipation is PD(MAX) = (TJ(MAX) - TA) / ΘJA where TJ(MAX) is 125°C. Exceeding the maximum allowable power dissipation will result in excessive die
temperature, and the device will enter thermal shutdown.
2. This thermal rating was calculated on JEDEC 51 standard 4-layer board with dimensions 3" x 4.5" in still air conditions.
3. Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted variables.
4. For the NBG32 package, connecting the 5 mm X 5 mm EP to internal/external ground planes with a 5x5 matrix of PCB plated-through-hole (PTH) vias, from top to bottom sides of
the PCB, is recommended for improving the overall thermal performance.
Table 3: ESD Information
5W, QI WIRELESS POWER RECEIVER WITH INTEGRATED RECTIFIER AND LDO OUTPUT