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IDT74FCT2244CT - FAST CMOS OCTAL BUFFER/LINE DRIVER

Download the IDT74FCT2244CT datasheet PDF. This datasheet also covers the IDT74FCT2244AT variant, as both devices belong to the same fast cmos octal buffer/line driver family and are provided as variant models within a single manufacturer datasheet.

General Description

The IDT octal buffer/line driver is built using an advanced dual metal CMOS technology.

The FCT2244T is designed to be employed as a memory and address driver, clock driver, and bus-oriented transmitter/ receiver which provides improved board density.

Key Features

  • A and C grades.
  • Low input and output leakage ≤1µA (max. ).
  • CMOS power levels.
  • True TTL input and output compatibility:.
  • VOH = 3.3V (typ. ).
  • VOL = 0.3V (typ. ).
  • Meets or exceeds JEDEC standard 18 specifications.
  • Resistor outputs (-15mA IOH, 12mA IOL).
  • Reduced system switching noise.
  • Available in SOIC and QSOP packages.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (IDT74FCT2244AT-Renesas.pdf) that lists specifications for multiple related part numbers.

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
IDT74FCT2244AT/CT FAST CMOS OCTAL BUFFER/LINE DRIVER FAST CMOS OCTAL BUFFER/LINE DRIVER INDUSTRIAL TEMPERATURE RANGE IDT74FCT2244AT/CT FEATURES: • A and C grades • Low input and output leakage ≤1µA (max.) • CMOS power levels • True TTL input and output compatibility: – VOH = 3.3V (typ.) – VOL = 0.3V (typ.) • Meets or exceeds JEDEC standard 18 specifications • Resistor outputs (-15mA IOH, 12mA IOL) • Reduced system switching noise • Available in SOIC and QSOP packages DESCRIPTION: The IDT octal buffer/line driver is built using an advanced dual metal CMOS technology. The FCT2244T is designed to be employed as a memory and address driver, clock driver, and bus-oriented transmitter/ receiver which provides improved board density.