1) Small high-powered package reduces mounting area by 36% at a maximum 2) Realization of high mounting reliability by original terminal and plating treatment 3) Assuring Tj=175℃ 4) AEC-Q101 Qualified
lOutline
HSMT8AG
lInner circuit
l.
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AG009DGQ3
3.3mm×3.3mm Package / Nch 40V 30A Power MOSFET
Datasheet
VDSS RDS(on)(Max.)
ID PD
40V 8.
AG009DGQ3 Datasheet
