* Fast Switching Device(TRR<4.0nS) * DO-35 Package (JEDEC) * Through-Hole Device Type Mounting * Hermetically Sealed Glass * Compression Bonded Construction * All externa.

and actual performance may vary over time. Rectron Inc does not assume any liability arising out of the application or u.

only. "Typical" parameters which may be included on RECTRON data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. Rectron Inc does not assume any liability arising out of the applicati.

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