ISP1040B processor equivalent, scsi i/o processor.
* Three metal, twin-well CMOS process.
* Sub-micron gate lengths (0.5 micron).
1These items present possible quality or reliability concerns.
They should be di.
Assembly Die Process and Design ANALYSIS RESULTS I Assembly ANALYSIS RESULTS II Die Process and Design ANALYSIS PROCEDURE
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TABLES Overall Evaluation Package Markings Wirebond Strength Die and Package Materials Horizontal Di.
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