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PKFC3.3C - 250W ENCAPSULATED FLIP CHIP TVS ARRAY

General Description

The PKFCxxC series encapsulated flip chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT).

Key Features

  • superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates overshoot voltage due to package inductance.

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Datasheet Details

Part number PKFC3.3C
Manufacturer Protek Devices
File Size 326.27 KB
Description 250W ENCAPSULATED FLIP CHIP TVS ARRAY
Datasheet download datasheet PKFC3.3C Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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05180 Only One Name Means ProTek’Tion™ 250W ENCAPSULATED FLIP CHIP TVS ARRAY PKFC3.3C - PKFC36C DESCRIPTION The PKFCxxC series encapsulated flip chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards. This series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 250 Watts per line for an 8/20µs waveform.