PKFC05C Datasheet | Protek Devices

Only One Name Means Pro Tek’Tion™ 250W ENCAPSULATED FLIP CHIP TVS ARRAY PKFC3.3C - PKFC36C DESCRIPTION The PKFCxx C series encapsulated flip chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards. This series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 250 Watts per line for an 8/20µs waveform. In addition, the PKFCxx C series Features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates overshoot voltage due to package inductance. Features - patible with IEC 61000-4-2 (ESD): Air 15k V, Contact 8k V - patible with IEC 61000-4-4 (EFT): 40A, 5/50ns - Chip Scale Package 0.050” x 0.030” - ESD Protection > 25 kilovolts - Available in Voltages Ranging from 3.3V to 36V - 250 Watts Peak Pulse Power per Line (tp = 8/20µs) - Bidirectional Configuration & Monolithic Structure - Protection for 1 Line - Ro HS pliant - REACH pliant MECHANICAL CHARACTERISTICS - Molded DFN-2 Package Configuration - Approximate Weight: 0.73 milligrams - Lead-Free Plating - Solder Reflow Temperature: - Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C - Flammability Rating UL 94V-0 - 8mm Tape per EIA Standard 481 APPLICATIONS - Cellular Phones - MCM...