PRLL4002 Datasheet | Philips Semiconductors

FEATURES - Glass passivated - High maximum operating temperature - Low leakage current - Excellent stability - Shipped in 8 mm embossed tape - Smallest surface mount rectifier outline. handbook, 4 columns PRLL4001; PRLL4002 DESCRIPTION Cavity free cylindrical glass package through Implotec™(1) technology. (1) Implotec is a trademark of Philips. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. k a MAM061 Marking code PRLL4001: 4001. Marking code PRLL4002: 4002. Fig.1 Simplified outline (SOD87) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM PARAMETER repetitive peak reverse voltage PRLL4001 PRLL4002 VR continuous reverse voltage PRLL4001 PRLL4002 IF(AV) average forward current averaged over any 20 ms period; Ttp = 105 °C averaged over any 20 ms period; Tamb = 65 °C; see Fig.2 IFRM IFSM Tstg Tj repetitive peak forward current non-repetitive peak forward current storage temperature junction temperature half sinewave; 60 Hz - - - - - - - 65 - 65 50 100 V V - - 50 100 V V CONDITIONS MIN. MAX. UNIT 1.60 A 0.68 A 10 20 +175 +175 A A °C °C 1996 Jun 10 Philips Semiconductors Product specification Rectifiers ELECTRICAL CHARACTERISTICS Tj = 25 °C; unless otherwise specified. SYMBOL VF VF(AV) IR IR(AV) PARAMETER forward voltage full-cycle average forward voltage reverse current full-cycle average reverse current IF(AV) = 1 A VR = VRmax VR = VRmax; Tamb = 100 °C PRLL4001; PRLL4002 CONDITIONS IF = 1 A; see Fig.3 MAX. 1.1 0.8 10 50 30 V V UNIT µA µA µA VR = VRRMmax; Tamb = 75 °C THERMAL CHARACTERISTICS SYMBOL Rth j-tp Rth j-a Note 1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥40 µm, see Fig.4. For more information please refer to the “General Part of associated Handbook”. PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient note 1 CONDITIONS VALUE 30...