BGW200 Overview
Key Specifications
Package: SIP
Pins: 68
Max Operating Temp: 85 °C
Min Operating Temp: -30 °C
Key Features
- Advanced, single-package WLAN SiP optimized for mobile handheld devices – No RF-critical design required – Low total cost of ownership
- Lowest power consumption in standby mode: < 2 mW (typ)
- Ultra-small form factor – Low-profile 68-pin HVQFN-like SiP package (10 x 15 x 1.3 mm) – Only three external components for entire solution
