EZANP - Chip Capacitor Networks

Features

s.
Chip Capacitor Networks, exclusively developed by Panasonic using thick ﬁlm technology. 8 capacitors bussed in one package (6.4 mm ҂ 3.1 mm ҂ 0.75 mm, 1.27 mm pitch), halfpitch (0.635 mm) spacing for high density automatic placing.
Excellent noise reduction by connecting both ground terminals and a simple layout pattern (less through hole).
Excellent mountability using concave terminals, ﬁrm solder joint (2 times that of convex terminal), self-aligning placement during reﬂow s.

EZANP chip capacitor networks by Panasonic Semiconductor - Datasheet Preview

Datasheet Details

Part number	EZANP
Manufacturer	Panasonic
File Size	145.63 KB
Description	Chip Capacitor Networks
Datasheet	EZANP Datasheet

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Full PDF Text Transcription

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Chip Capacitor Networks www.DataSheet4U.com Chip Capacitor Networks Type: EZANP GND GND ■ Features ● Chip Capacitor Networks, exclusively developed by Panasonic using thick ﬁlm technology. 8 capacitors bussed in one package (6.4 mm ҂ 3.1 mm ҂ 0.75 mm, 1.27 mm pitch), halfpitch (0.635 mm) spacing for high density automatic placing ● Excellent noise reduction by connecting both ground terminals and a simple layout pattern (less through hole) ● Excellent mountability using concave terminals, ﬁrm solder joint (2 times that of convex terminal), self-aligning placement during reﬂow soldering I/O I/O I/O No Through Hole 0.

Published: Sep 6, 2010 |