ELJRF33NFB
Features
High frequency capability due to its non magnetic core. Capable of being Re-flow or flow soldered. Unique Ceramic Core/Laser-cut Technology. Non polarity product. Good for mounting. Ro HS pliant
- Remended Applications
RF circuitry for cellular phones and wireless munication equipment.
- Explanation of Part Numbers
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Packaging Design No.
Product code Chip Inductors RF RE Shape 1005 (0402) 1608 (0603) Inductance 1N5 10N R22 1.5 n H 10 n H 220 n H Inductance tolerance Z D G J ±0.2 n H ±0.3 n H ±2 % ±5 % F Taping
Size : mm (inch)
Storage Conditions
Package : Normal temperature (- 5 to 35 °C), normal humidity (85 %RH max.), shall not be exposed to direct sunlight and harmful gases and care should be taken so as not to cause dew. Operating Temperature :
- 40 to +85 °C
Storage Period
Solderability may be reduced due to the conditions of high temperature and high humidity which causes the oxidation of tin-plated terminals. Even if...
