Chip surface passivation Lead frame material Inner lead surface process Others ( Others ( Others ( ) ) ) ) 1 2 , 6 2 6 3 4 4 5 5 7 *3 *3 Outer lead surface process Chip mounting method Wire bonding method Wire material Mold material Molding metho.

AN17808A

AN17803A

AN17807

AN17807A

AN17810A

AN17811A

AN17812A

AN17813A

AN17820A

AN17820B

AN17821A

AN17822A

AN17823

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