| Description | Chip surface passivation Lead frame material Inner lead surface process Others ( Others ( Others ( ) ) ) ) 1 2 , 6 2 6 3 4 4 5 5 7 *3 *3 Outer lead surface process Chip mounting method Wire bonding method Wire material Mold material Molding method Fin material Solder plating (98Sn-2Bi), Solder dip, Others ( Ag paste, Au-Si alloy, Solder (95.5Pb-2.5Ag-2Sn)** Others ( Others ( Others ( Others ... |
| Features |
Higuchi
AN17808B
Package Name Unit : mm
12-SIL(FP)
FP-12S
∅ 3.6
6.4 ± 0.3
7.7 ± 0.3
12
7.8 ± 0.3
29.96 ± 0.3
28.0 ± 0.3
20.0±0.1
0.6
R1.8
1
1.2 ± 0.1
+0.1 0.25 -0.05
2.54
0.6 ± 0.1
*4 Eff. Date 28-MAR-05
Eff. Date
Eff. Date
Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd.
FMSC-PSDA-002-01 REV 1
3.5 ± ...
|
| Datasheet |
 AN17808B Datasheet - 976.01KB |
