P6SMB8xA Datasheet | PanJit Semiconductor

Key Features

• For surface mounted applications in order to optimize board space
• Low profile package
• Built-in strain relief
• Glass passivated junction
• Low inductance
• Typical ID less than 1.0µA above 10V
• Plastic package has Underwriters Laboratory Fammability Classification 94V-O
• High temperature soldering : 260°C /10 seconds at terminals