1SMA5939
Key Features
- For surface mounted applications in order to optimize board space
- Built-in strain relief
- Glass passivated junction
- Low inductance
- Typical IR less than 1.0µA above 12V
- Plastic package has Underwriters Laboratory Flammability Classification 94V-O
- High temperature soldering : 260°C /10 seconds at terminals
- Low profile package
- Case: JEDEC DO-214AC,Molded plastic over passivated junction
- Terminals: Solder plated,solderable per MIL-STD-750, Method 2026
