Epoxy molded,single-in-line package. Can be immersed during board cleaning operations Hing density board mounting. Hing isolation between input and output Diode and Magn.

SIP-1A05

SIP-1A12

SIP08F

SIP08G

SIP08J

SIP10F

SIP10G

SIP10J

SIP11203DB

SiP12101

SiP12107

SIP12109

SiP12116

Since 2006. D4U Semicon.   |   Contact Us   |   Privacy Policy   |   Purchase of parts