P4SMAFJ8.0A
Key Features
- For surface mounted applications in order to optimize board space
- Glass passivated junction
- Low inductance
- Ultra thin profile package for space constrained utilization
- Package suitable for automated handling
- Plastic package has Underwriters Laboratory Flammability
- High temperature soldering : 260°C /10 seconds at terminals
- Green molding pound as per IEC61249 Std. . (Halogen Free)
- Case: Plastic molded
- Terminals: Solder plated, solderable per MIL-STD-750,Method2026
