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GDZJ27 Datasheet

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PAN JIT · GDZJ27 File Size : 99.88KB · 1 hits

Features and Benefits


• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in compliance with EU RoHS 2011/65/EU directives MECHANICAL DATA
• Case: Molded Glass DO-34
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx. Weight: 0.0033 ounces, 0.094 g.

GDZJ27 GDZJ27 GDZJ27
TAGS
AXIAL
LEAD
ZENER
DIODES
GDZJ2.0
GDZJ2.0A
GDZJ2.0A-N
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