GDZJ27 Datasheet

Features and Benefits

• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in compliance with EU RoHS 2011/65/EU directives MECHANICAL DATA
• Case: Molded Glass DO-34
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx. Weight: 0.0033 ounces, 0.094 g.