• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in compliance with EU RoHS 2011/65/EU directive
MECHANICAL DATA
• Case: Molded Glass DO-35
• Terminals: Solderable per MIL-STD-750, Method 2026
• Polarity: See Diagram Below
• Approx. W.