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FM180-N - Chip Schottky Barrier Rectifier

Download the FM180-N datasheet PDF. This datasheet also covers the FM150-N variant, as both devices belong to the same chip schottky barrier rectifier family and are provided as variant models within a single manufacturer datasheet.

Key Features

  • Batch process design, excellent power dissipation offers.
  • better reverse leakage current and thermal resistance. Low profile surface mounted.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (FM150-N_PACELEADERINDUSTRIAL.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number FM180-N
Manufacturer PACELEADER INDUSTRIAL
File Size 238.25 KB
Description Chip Schottky Barrier Rectifier
Datasheet download datasheet FM180-N Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
FM180-M Silicon epitaxial planer type Formosa MS
FM180-MH Chip Schottky Barrier Diodes Formosa MS
FM180-MS SMD Schottky Barrier Rectifier Formosa MS
FM180-S Chip Schottky Barrier Diodes Formosa MS
FM180 SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER Rectron

Other Datasheets by PACELEADER INDUSTRIAL

Part Number Description
FM1100-N Chip Schottky Barrier Rectifier
FM120-N Chip Schottky Barrier Rectifier
FM130-N Chip Schottky Barrier Rectifier
FM140-N Chip Schottky Barrier Rectifier
FM150-N Chip Schottky Barrier Rectifier

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
FM120-N THRU FM1100-N CHIP SCHOTTKY BARRIER RECTIFIER 1.0A Surface Mount Schottky Barrier Rectifiers - 20V-100V SOD-323 0.106 (2.7) 0.091 (2.3) 0.012(0.3) Typ. 0.057 (1.45) 0.041 (1.05) 0.047 (1.2) 0.031 (0.8) 0.016(0.4) Typ. 0.016(0.4) Typ. FEATURES • Batch process design, excellent power dissipation offers • • • • • • • • • better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. Low power loss, high efficiency. High current capability, low forward voltage drop. High surge capability. Guardring for overvoltage protection. Very tiny plastic SMD package. Ultra high-speed switching. Silicon epitaxial planar chip, metal silicon junction.