* Advanced Dual−Sided Cooled Packaging
* Ultra Low RDS(on) to Minimize Conduction Losses
* MSL1 Robust Packaging Design
* These Devices are Pb−Free, Halog.

* Orring FET/Load Switching
* Synchronous Rectifier
* DC−DC Conversion MAXIMUM RATINGS (TJ = 25°C, Unless o.

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