Quad 2−Channel Multiplexer
The MC74VHCT157A is an advanced high speed CMOS quad
2−channel multiplexer fabricated with silicon gate CMOS technology.
It achieves high speed operation similar to equivalent Bipolar
Schottky TTL while maintaining CMOS low power dissipation.
It consists of four 2−input digital multiplexers with common select
(S) and enable (E) inputs. When E is held High, selection of data is
inhibited and all the outputs go Low.
The select decoding determines whether the A or B inputs get routed
to the corresponding Y outputs.
The VHCT inputs are compatible with TTL levels. This device can
be used as a level converter for interfacing 3.3 V to 5.0 V because it
has full 5.0 V CMOS level output swings.
The VHCT157A input structures provide protection when voltages
between 0 V and 5.5 V are applied, regardless of the supply voltage.
The output structures also provide protection when VCC = 0 V. These
input and output structures help prevent device destruction caused by
supply voltage−input/output voltage mismatch, battery backup, hot
The inputs tolerate voltages up to 7.0 V, allowing the interface of
5.0 V systems to 3.0 V systems.
• High Speed: tPD = 4.1 ns (Typ) at VCC = 5.0 V
Low Power Dissipation: ICC = 4 mA (Max) at TA = 25°C
• TTL−Compatible Inputs: VIL = 0.8 V; VIH = 2.0 V
• Power Down Protection Provided on Inputs and Outputs
• Balanced Propagation Delays
• Designed for 2.0 V to 5.5 V Operating Range
• Low Noise: VOLP = 0.8 V (Max)
• Pin and Function Compatible with Other Standard Logic Families
• Latchup Performance Exceeds 300 mA
• ESD Performance:
Human Body Model > 2000 V;
Machine Model > 200 V
• Chip Complexity: 82 FETs or 20 Equivalent Gates
• Pb−Free Packages are Available*
A = Assembly Location
WL, L = Wafer Lot
Y = Year
WW, W = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
Y0 − Y3
A0 − A3, B0 − B3 = the levels of
the respective Data−Word Inputs.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2005
December, 2005 − Rev. 2
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Publication Order Number: