FAM65HR51DS2 Datasheet | onsemi

Features - SIP or DIP H- Bridge Power Module for On- board Charger (OBC) in EV or PHEV - 5 k V/1 sec Electrically Isolated Substrate for Easy Assembly - Creepage and Clearance per IEC60664- 1, IEC 60950- 1 - pact Design for Low Total Module Resistance - Module Serialization for Full Traceability - Lead Free, Ro HS and UL94V- 0 pliant - Automotive Qualified per AEC Q101 and AQG324 Guidelines Applications - DC- DC Converter for On- board Charger in EV or PHEV Benefits - Enable Design of Small, Efficient and Reliable System for Reduced Vehicle Fuel Consumption and CO2 Emission - Simplified Assembly, Optimized Layout, High Level of Integration, and Improved Thermal Performance .onsemi. APMCA- B16 16 LEAD CASE MODGJ MARKING DIAGRAM XXXXXXXXXXX ZZZ ATYWW NNNNNNN XXXX = Specific Device Code ZZZ = Lot ID AT = Assembly & Test Location Y = Year W = Work Week NNN = Serial Number ORDERING INFORMATION See detailed ordering, marking and shipping information on page 2 of this data sheet. © Semiconductor ponents Industries, LLC, 2021 May, 2021 - Rev. 1 Publication Order Number: FAM65HR51DS2/D ORDERING INFORMATION Part Number FAM65HR51DS2 Package APM16- CAB Lead Forming L- Shape Snubber Capacitor Inside Yes DBC Material Al2O3 Pb- Free and Operating Ro HS pliant Temperature...