CS5205−1, CS5205−3, CS5205−5
VOUT
VIN
Thermal
Shutdown
Bandgap
Output
Current
Limit
− + Error
Amplifier
GND
Figure 2. Block Diagram − CS5205−3, −5
MAXIMUM RATINGS*
Supply Voltage, VCC
Operating Temperature Range
Junction Temperature
Storage Temperature Range
Lead Temperature Soldering:
Parameter
1. 10 second maximum.
2. 60 second maximum above 183°C.
*The maximum package power dissipation must be observed.
Wave Solder (through hole styles only) Note 1
Reflow (SMD styles only) Note 2
Value
17
−40 to +70
150
−60 to +150
260 Peak
230 Peak
Unit
V
°C
°C
°C
°C
°C
ELECTRICAL CHARACTERISTICS (CIN = 10 mF, C OUT = 22 mF Tantalum, VIN − VOUT = 3.0 V, VIN ≤ 15 V,
0°C ≤ TA ≤ 70°C, TJ ≤ +150°C, unless otherwise specified, Ifull load = 5.0 A.)
Characteristic
Test Conditions
Min Typ
Max Unit
Adjustable Output Voltage (CS5205−1)
Reference Voltage (Notes 3 and 4)
Line Regulation
Load Regulation (Notes 3 and 4)
Dropout Voltage (Note 5)
Current Limit
Minimum Load Current
Adjust Pin Current
VIN − VOUT = 1.5 V; VAdj = 0 V,
10 mA ≤ IOUT ≤ 5.0 A
1.5 V ≤ VIN − VOUT ≤ 6.0 V; IOUT = 10 mA
VIN − VOUT = 1.5 V; 10 mA ≤ IOUT ≤ 5.0 A
IOUT = 5.0 A
VIN − VOUT = 3.0 V; TJ ≥ 25°C
VIN − VOUT = 9.0 V
VIN − VOUT = 7.0 V
−
1.241
(−1%)
−
−
−
5.5
−
−
−
1.254
0.04
0.08
1.2
8.5
1.0
1.2
50
1.266
(+1%)
0.20
0.4
1.3
−
−
6.0
100
V
%
%
V
A
A
mA
mA
Adjust Pin Current Change
1.5 V ≤ VIN − VOUT ≤ 4.0 V;
10 mA ≤ IOUT ≤ 5.0 A
− 0.2 5.0 mA
Thermal Regulation
30 ms pulse; TA = 25°C
− 0.003 − %W
3. Load regulation and output voltage are measured at a constant junction temperature by low duty cycle pulse testing. Changes i n output
voltage due to thermal gradients or temperature changes must be taken into account separately.
4. Specifications apply for an external Kelvin sense connection at a point on the output pin 1/4” from the bottom of the package.
5. Dropout voltage is a measurement of the minimum input/output differential at full load.
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