CS5204−1, CS5204−3, CS5204−5
VOUT
VIN
Thermal
Shutdown
Bandgap
Output
Current
Limit
− + Error
Amplifier
GND
Figure 2. Block Diagram − CS5204−3, −5
MAXIMUM RATINGS*
Supply Voltage, VCC
Operating Temperature Range
Junction Temperature
Storage Temperature Range
Lead Temperature Soldering:
Parameter
1. 10 second maximum.
2. 60 second maximum above 183°C.
*The maximum package power dissipation must be observed.
Wave Solder (through hole styles only) Note 1
Reflow (SMD styles only) Note 2
Value
17
−40 to +70
150
−60 to +150
260 Peak
230 Peak
Unit
V
°C
°C
°C
°C
ELECTRICAL CHARACTERISTICS (CIN = 10 mF, COUT = 22 mF Tantalum, VIN − VOUT = 3.0 V, VIN ≤ 15 V,
0°C ≤ TA ≤ 70°C, TJ ≤ +150°C, unless otherwise specified, Ifull load = 4.0 A.)
Characteristic
Test Conditions
Min Typ
Max Unit
Adjustable Output Voltage (CS5204−1)
Reference Voltage (Notes 3 and 4)
Line Regulation
Load Regulation (Notes 3 and 4)
Dropout Voltage (Note 5)
Current Limit
Minimum Load Current
Adjust Pin Current
VIN − VOUT = 1.5 V; VAdj = 0 V,
10 mA ≤ IOUT ≤ 4.0 A
1.5 V ≤ VIN − VOUT ≤ 6.0 V; IOUT = 10 mA
VIN − VOUT = 1.5 V; 10 mA ≤ IOUT ≤ 4.0 A
IOUT = 4.0 A
VIN − VOUT = 3.0 V; TJ ≥ 25°C
VIN − VOUT = 9.0 V
VIN − VOUT = 7.0 V
−
1.241
(−1%)
−
−
−
4.5
−
−
−
1.254
0.04
0.05
1.1
8.5
1.0
1.2
50
1.266
(+1%)
0.20
0.4
1.2
−
−
6.0
100
V
%
%
V
A
A
mA
mA
Adjust Pin Current Change
1.5 V ≤ VIN − VOUT ≤ 4.0 V;
10 mA ≤ IOUT ≤ 4.0 A
− 0.2 5.0 mA
Thermal Regulation
30 ms pulse; TA = 25°C
− 0.003 − %/W
3. Load regulation and output voltage are measured at a constant junction temperature by low duty cycle pulse testing. Changes in output
voltage due to thermal gradients or temperature changes must be taken into account separately.
4. Specifications apply for an external Kelvin sense connection at a point on the output pin 1/4” from the bottom of the package.
5. Dropout voltage is a measurement of the minimum input/output differentials at full load.
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