CS1088
MAXIMUM RATINGS*
Supply Voltage (VBB)
Input Voltages (DIN, CLK, STB, GREN)
Junction Temperature Range
Storage Temperature Range
ESD Susceptibility (Human Body Model)
ESD Susceptibility (Machine Model)
Package Thermal Resistance, DIP–40
Junction–to–Case, RθJC
Junction–to–Ambient, RθJA
Lead Temperature Soldering:
Parameter
1. 10 second maximum.
2. 60 second maximum above 183°C.
*The maximum package power dissipation must be observed.
Value
–0.6 to +18
–0.6 to +6.0
–40 to +150
–55 to +150
2.0
200
Wave Solder (through hole styles only) Note 1
Reflow (SMD styles only) Note 2
20
45
260 Peak
230 Peak
Unit
V
V
°C
°C
kV
V
°C/W
°C/W
°C
ELECTRICAL CHARACTERISTICS (8.0 V ≤ VBB ≤ 16.5 V, Gnd = 0 V, –40°C ≤ TJ ≤ 105°C; unless otherwise stated. Note 3.)
Parameter
Test Conditions
Min Typ Max Unit
VBB Input
VBB Input Voltage
IBB0 Current
Reset Mode
–
No outputs active, VBB = 16.5 V
All outputs forced low.
8.0 – 16.5 V
– 2.0 5.0 mA
– 6.5 7.5 V
DIN, CLK, STB Inputs
VIL1, Input Low Voltage
VIH, Input High Voltage
IIL, Input Current
GREN Input
VIN = VIH
–
–
– – 1.6 V
3.3 – – V
– 7.5 20.0 µA
VIL, Input Low Voltage
VIH, Input High Voltage
IIH, Input Pull–down Current
GRID1, GRID2, GRID3 Outputs
VIN = 3.325 V
–
–
– – 1.6 V
3.3 – – V
– 30 60 µA
IOL
IOH
VOL
VOH
AN24 – AN29 Outputs
Sink Current
Source Current
IOUT = 1.0 mA
IOUT = –50 mA, VBB = 12 V
1.0
50
–
VBB – 0.75
–
–
–
–
– mA
– mA
0.5 V
VBB V
IOL
Sink Current
400 –
– µA
IOH
Source Current
20 –
– mA
VOL
IOUT = 400 µA
– – 0.5 V
VOH
IOUT = –20 mA, VBB = 12 V
VBB – 0.5
–
VBB
V
3. Designed to meet these characteristics over the stated voltage and temperature ranges, though may not be 100% parametrically tested
in production.
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