BSP19AT1G transistor equivalent, npn silicon expitaxial transistor.
* High Voltage
* The SOT-223 Package Can Be Soldered Using Wave or Reflow
* SOT-223 Package Ensures Level Mounting, Resulting in Improved
Thermal Conduction, .
The device is housed in the SOT−223 package which is designed for medium power surface mount applications.
Features
Image gallery
TAGS
Download (Size : 95.29KB)