Datasheet4U Logo Datasheet4U.com

OSD3358 - BAS/IND Processor

Description

17 5.2 AM335x Relocated Signals 20 5.3 Not Connected Balls 20 5.4 Reserved Signals 21 6 OSD335x Components 22 6.1 AM335x Processor 22 6.1.1 I/O Voltages 22 6.2 DDR3 Memory 22 7 Power Management 24 7.1 Input Power 24 7.1.1 VIN_AC 24 7.1.2 VIN_USB 24 7.1.3 VIN_BAT 24 7.2 Output Power 24 7.2.1

Features

  • TI AM335x, TPS65217C, TL5209, DDR3, and over 140 Passive components integrated into a single package.
  • TI AM335x Features: o ARM® Cortex®-A8 up to 1GHz o 8 channel 12-bit SAR ADC o Ethernet 10/100/1000 x2 o USB 2.0 HS OTG + PHY x2 o MMC, SD and SDIO x2 o LCD Controller o SGX 3D Graphics Engine o PRU Subsystem.
  • Access to All AM335x Peripherals: CAN, SPI, UART, I2C, GPIO, etc.
  • Up to 1GB DDR3.
  • PWR In: AC Adapter, USB or Single cell (1S) Li-Ion / Li-Po B.

📥 Download Datasheet

Datasheet Details

Part number OSD3358
Manufacturer OCTAVO
File Size 0.99 MB
Description BAS/IND Processor
Datasheet download datasheet OSD3358 Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
Introduction The OSD335x Family of System-InPackage (SIP) products are building blocks designed to allow easy and cost-effective implementation of systems based on Texas Instruments’ powerful Sitara™ AM335x line of processors. The OSD335x integrates the AM335x along with the TI TPS65217C PMIC, the TI TL5209 LDO, up to 1 Gigabyte of DDR3 Memory, and resistors, capacitors, and inductors all into a single 27mm x 27mm design-in-ready package. With this level of integration, the OSD335x Family of SIPs allows designers to focus on the key aspects of their system without spending time on the complicated highspeed design of the processor/DDR3 interface or the PMIC power distribution. It also reduces the overall size and complexity of the design and the supply chain.
Published: |