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QS7779PM - 3D Stereo Enhancement and 3D Virtual Stereo Surround

Description

Name Number P arallel 1 2 3 4 5 6 7 8 9 10 11 SPRD 12 BYP 13 14 15 MUTE 16 17 18 19 20 21 22 23 24 LOUT ROUT QXBC4 QXBC3 QXBC2 QXBC1 VCC QXAC4 STRB I O O I I I I I P/S VDD QXAC3 QXAC2 QXAC1 RIN LIN COUT CIN VREFIN VREFOUT VREF GND SCL1

Features

  • s s s s s Capable of decoding Dolby Surround materials such as Dolby Pro Logic or other matrix surround encoded materials (DVD/AC.
  • 3) Virtualized surround sound with two speakers 3D stereo sound enhancement Two enhanced levels Parallel and serial digital interface for mode control s s.
  • QS7779CM for I2C 2 control pins serial interface (Data, Clock).
  • QS7779PM for three-wire serial interface (Data, Clock and Strobe) Supply voltage (analog): 5 to 13V Supply voltage (dig.

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Datasheet Details

Part number QS7779PM
Manufacturer Nippon Precision Circuits Inc
File Size 114.06 KB
Description 3D Stereo Enhancement and 3D Virtual Stereo Surround
Datasheet download datasheet QS7779PM Datasheet

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Other Datasheets by Nippon Precision Circuits Inc

Part Number Description
QS7779CM 3D Stereo Enhancement and 3D Virtual Stereo Surround
QS7785 3D 2/4-Channel Stereo Surround Synthesizer
QS7785CF 3D 2/4-Channel Stereo Surround Synthesizer
QS7785PF 3D 2/4-Channel Stereo Surround Synthesizer

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
QS7779PM/CM NIPPON PRECISION CIRCUITS INC. 3D Stereo Enhancement and 3D Virtual Stereo Surround with Dolby Pro Logic and Mixed DVD (AC-3) Decoder OVERVIEW The QS7779PM/CM is an audio processor IC which implements a decoder for stereo matrix encoded source materials such as the Dolby Surround Pro Logic and mixed DVD (AC−3) with surround virtualization using QSound™ technology developed and licensed by QSound Labs, Inc. This chip produces enhanced stereo sound for a stereo input signal and if the input signal contains matrix encoded surround sound, the chip decodes it and produces 3D virtualized surround sounds with two speakers.
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