PMPB33XN Datasheet (PDF) Download
NXP Semiconductors
PMPB33XN

Key Features

  • Trench MOSFET technology
  • Very fast switching
  • Small and leadless ultra thin SMD plastic package: 2 x 2 x 0.65 mm
  • Exposed drain pad for excellent thermal conduction
  • Tin-plated 100 % solderable side pads for optical solder inspection 1.3 Applications
  • Charging switch for portable devices
  • DC-to-DC converters
  • Power management in battery-driven portables
  • Hard disk and puting power management 1.4 Quick reference data Table
  • Max 30 12 5.5 Unit V V A Static characteristics drain-source on-state resistance [1] 2