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NXP Semiconductors Electronic Components Datasheet

PCF2123 Datasheet

SPI Real time clock/calendar

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PCF2123
SPI Real time clock/calendar
Rev. 6 — 15 July 2013
Product data sheet
1. General description
The PCF2123 is a CMOS1 Real-Time Clock (RTC) and calendar optimized for low power
applications. Data is transferred serially via a Serial Peripheral Interface (SPI-bus) with a
maximum data rate of 6.25 Mbit/s. An alarm and timer function is also available providing
the possibility to generate a wake-up signal on an interrupt pin. An offset register allows
fine tuning of the clock.
2. Features and benefits
Real time clock provides year, month, day, weekday, hours, minutes, and seconds
based on a 32.768 kHz quartz crystal
Low backup current while running: typical 100 nA at VDD = 2.0 V and Tamb = 25 C
Resolution: seconds to years
Watchdog functionality
Freely programmable timer and alarm with interrupt capability
Clock operating voltage: 1.1 V to 5.5 V
3 line SPI-bus with separate, but combinable data input and output
Serial interface at VDD = 1.8 V to 5.5 V
1 second or 1 minute interrupt output
Integrated oscillator load capacitors for CL = 7 pF
Internal Power-On Reset (POR)
Open-drain interrupt and clock output pins
Programmable offset register for frequency adjustment
3. Applications
Time keeping application
Battery powered devices
Metering
High duration timers
Daily alarms
Low standby power applications
1. The definition of the abbreviations and acronyms used in this data sheet can be found in Section 22.


NXP Semiconductors Electronic Components Datasheet

PCF2123 Datasheet

SPI Real time clock/calendar

No Preview Available !

NXP Semiconductors
PCF2123
SPI Real time clock/calendar
4. Ordering information
Table 1. Ordering information
Type number
Package
Name
PCF2123BS
HVQFN16
PCF2123TS
TSSOP14
PCF2123U/10AA
PCF2123U/12AA
PCF2123U/12HA
PCF2123U/5GA
wire bond die
WLCSP12
WLCSP12
wire bond die
Description
plastic thermal enhanced very thin quad flat package;
no leads; 16 terminals; body 3 3 0.85 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
12 bonding pads
wafer level chip size package; 12 bumps
wafer level chip size package; 12 bumps
12 bonding pads
Version
SOT758-1
SOT402-1
PCF2123U/10
PCF2123U/12
PCF2123U/12
PCF2123U/10
4.1 Ordering options
Table 2. Ordering options
Product type number
Sales item (12NC)
PCF2123BS/1
PCF2123TS/1
PCF2123U/10AA/1
935286382512
935286382518
935286384112
935286384118
935287542005
PCF2123U/12AA/1
935290647005
PCF2123U/12HA/1
935292966005
PCF2123U/5GA/1
935295429015
Orderable part
number
IC
revision
PCF2123BS/1,512 1
PCF2123BS/1,518 1
PCF2123TS/1,112 1
PCF2123TS/1,118 1
PCF2123U/10AA/1,00 1
PCF2123U/12AA/1,00 1
PCF2123U/12HA/1,00 1
PCF2123U/5GA/1,015 1
Delivery form
tube, dry pack
tape and reel, 13 inch, dry pack
tube
tape and reel, 13 inch
sawn 6 inch wafer on Film Frame
Carrier (FFC) for 6 inch wafer
sawn 6 inch wafer on plastic Film
Frame Carrier (FFC) for 8 inch
wafer
sawn 6 inch wafer on plastic Film
Frame Carrier (FFC) for 8 inch
wafer
wafer, unsawn
5. Marking
Table 3. Marking codes
Type number
PCF2123BS
PCF2123TS
PCF2123U/10AA
PCF2123U/12AA
PCF2123U/12HA
PCF2123U/5GA
Marking code
123
PCF2123
PC2123-1
PC2123-1
PC2123-1
PC2123-1
PCF2123
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 15 July 2013
© NXP B.V. 2013. All rights reserved.
2 of 64


Part Number PCF2123
Description SPI Real time clock/calendar
Maker NXP Semiconductors
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PCF2123 Datasheet PDF






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