PCF2123 Datasheet | NXP Semiconductors

description The PCF2123 is a CMOS1 Real-Time Clock (RTC) and calendar optimized for low power applications. Data is transferred serially via a Serial Peripheral Interface (SPI-bus) with a maximum data rate of 6.25 Mbit/s. An alarm and timer function is also available providing the possibility to generate a wake-up signal on an interrupt pin. An offset register allows fine tuning of the clock. 2. Features and benefits - Real time clock provides year, month, day, weekday, hours, minutes, and seconds based on a 32.768 k Hz quartz crystal - Low backup current while running: typical 100 n A at VDD = 2.0 V and Tamb = 25 C - Resolution: seconds to years - Watchdog functionality - Freely programmable timer and alarm with interrupt capability - Clock operating voltage: 1.1 V to 5.5 V - 3 line SPI-bus with separate, but binable data input and output - Serial interface at VDD = 1.8 V to 5.5 V - 1 second or 1 minute interrupt output - Integrated oscillator load capacitors for CL = 7 p F - Internal Power-On Reset (POR) - Open-drain interrupt and clock output pins - Programmable offset register for frequency adjustment 3. Applications - Time keeping application - Battery powered devices - Metering - High duration timers - Daily alarms - Low standby power applications 1. The definition of the abbreviations and acronyms used in this data sheet can be found in Section 22. NXP Semiconductors SPI Real time clock/calendar 4. Ordering information Table 1. Ordering information Type number Package Name PCF2123BS HVQFN16 PCF2123TS TSSOP14 PCF2123U/10AA PCF2123U/12AA PCF2123U/12HA PCF2123U/5GA wire bond die WLCSP12 WLCSP12 wire bond die Description plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3  3  0.85 mm plastic thin shrink small outline package; 14 leads; body width 4.4 mm 12 bonding pads wafer level chip size package; 12 bumps wafer level chip size package; 12 bumps 12 bonding pads Version SOT758-1 SOT402-1 PCF2123U/10...