SL2ICS2001V1D Overview
This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of I-CODE SLI Label ICs on an NXP C075EE process and is the base for delivery of tested I-CODE SLI Label ICs. Ordering information Table 1. Ordering information Type number Package Name SL2ICS2001DW/V1D - Description Bumped die on sawn wafer on UV-tape.