SL2ICS2001V1D uv-tape equivalent, i-code sli label ic bumped wafer specification on uv-tape.
This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of I-CODE SLI Label ICs on an NXP C075EE process and is the base for delivery of tested I-CODE SLI Label ICs.
2. Ordering i.
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