SL2ICS2001V1D
description
This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of I-CODE SLI Label ICs on an NXP C075EE process and is the base for delivery of tested I-CODE SLI Label ICs.
2. Ordering information
Table 1. Ordering information
Type number
Package
Name
SL2ICS2001DW/V1D
- Description
Bumped die on sawn wafer on UV-tape
3. Mechanical specification
Odering code 9352 795 61005
3.1 Wafer
- Diameter:
- Thickness:
3.2 Wafer backside
- Material:
- Treatment:
- Roughness:
3.3 Chip dimensions
- Chip size:
- Scribe lines:
3.4 Passivation
- Type:
- Material:
- Thickness:
8” 150 μm ± 15 μm
Si ground and stress release Ra max. 0.5 μm Rt max. 5 μm
900 x 780 μm2 80 / 80 μm sandwich structure PSG / Nitride (on top) 500 nm / 600 nm
NXP Semiconductors
SL2ICS2001DW/V1D
I-CODE SLI Label IC bumped wafer specification on UV-tape
PUBLIC
3.5 Au bump
- Bump material:
- Bump hardness:
- Bump shear strength:
- Bump height:
-...
