Philips Semiconductors
PowerMOS transistor
Product specification
PHP2N50
ELECTRICAL CHARACTERISTICS
Tj = 25 ˚C unless otherwise specified
SYMBOL PARAMETER
V(BR)DSS
∆V(BR)DSS /
∆Tj
RDS(ON)
VGS(TO)
gfs
IDSS
Drain-source breakdown
voltage
Drain-source breakdown
voltage temperature coefficient
Drain-source on resistance
Gate threshold voltage
Forward transconductance
Drain-source leakage current
IGSS
Qg(tot)
Qgs
Qgd
td(on)
tr
td(off)
tf
Ld
Gate-source leakage current
Total gate charge
Gate-source charge
Gate-drain (Miller) charge
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
Internal drain inductance
Ld Internal drain inductance
Ls Internal source inductance
Ciss Input capacitance
Coss Output capacitance
Crss Feedback capacitance
CONDITIONS
VGS = 0 V; ID = 0.25 mA
VDS = VGS; ID = 0.25 mA
VGS = 10 V; ID = 1 A
VDS = VGS; ID = 0.25 mA
VDS = 30 V; ID = 1 A
VDS = 500 V; VGS = 0 V
VDS = 400 V; VGS = 0 V; Tj = 125 ˚C
VGS = ±30 V; VDS = 0 V
ID = 2 A; VDD = 400 V; VGS = 10 V
VDD = 250 V; ID = 2 A;
RG = 24 Ω; RD = 120 Ω
Measured from contact screw on
tab to centre of die
Measured from drain lead 6 mm
from package to centre of die
Measured from source lead 6 mm
from package to source bond pad
VGS = 0 V; VDS = 25 V; f = 1 MHz
MIN.
500
-
-
2.0
0.5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
TYP. MAX. UNIT
- -V
0.6 - V/K
3.1 5
Ω
3.0 4.0 V
1.3 -
S
1 25 µA
30 250 µA
10 200 nA
20 25 nC
2 3 nC
12 15 nC
10 - ns
20 - ns
60 - ns
20 - ns
3.5 - nH
4.5 - nH
7.5 - nH
236 -
40 -
22 -
pF
pF
pF
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Tj = 25 ˚C unless otherwise specified
SYMBOL PARAMETER
CONDITIONS
IS
Continuous source current
Tmb = 25˚C
(body diode)
ISM Pulsed source current (body Tmb = 25˚C
diode)
VSD Diode forward voltage
IS = 2 A; VGS = 0 V
trr Reverse recovery time IS = 2 A; VGS = 0 V; dI/dt = 100 A/µs
Qrr Reverse recovery charge
MIN.
-
-
-
-
-
TYP.
-
-
-
300
2.1
MAX. UNIT
2A
8A
1.2 V
- ns
- µC
June 1997
2
Rev 1.000
