PDTD123EQA Datasheet (PDF) Download
NXP Semiconductors
PDTD123EQA

Description

NPN Resistor-Equipped Transistor (RET) family in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.

Key Features

  • 500 mA output current capability
  • Built-in bias resistors
  •  10% resistor ratio tolerance
  • Simplifies circuit design
  • Reduces component count
  • Reduced pick and place costs
  • Low package height of 0.37 mm
  • Suitable for Automatic Optical Inspection (AOI) of solder joint
  • AEC-Q101 qualified