Datasheet Details
| Part number | PCF5079 |
|---|---|
| Manufacturer | NXP Semiconductors |
| File Size | 146.59 KB |
| Description | Dual-band power amplifier controller |
| Datasheet | PCF5079_PhilipsSemiconductors.pdf |
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Overview: INTEGRATED CIRCUITS DATA SHEET PCF5079 Dual-band power amplifier controller for GSM, PCN and DCS Product specification File under Integrated Circuits, IC17 2001 Nov 21 Philips Semiconductors Product specification Dual-band power amplifier controller for GSM, PCN and DCS CONTENTS 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 8 9 10 11 12 12.1 12.2 12.3 12.
| Part number | PCF5079 |
|---|---|
| Manufacturer | NXP Semiconductors |
| File Size | 146.59 KB |
| Description | Dual-band power amplifier controller |
| Datasheet | PCF5079_PhilipsSemiconductors.pdf |
|
|
|
QUICK REFERENCE DATA BLOCK DIAGRAM PINNING Pin description Pin configurations FUNCTIONAL DESCRIPTION General Power-up mode OP4 (integrator) Start-up and initial conditions Home position voltage End of burst Considerations for ramp-down Configurations Summary of current and voltage definitions Timing LIMITING VALUES ELECTROSTATIC DISCHARGE (ESD) DC CHARACTERISTICS OPERATING CHARACTERISTICS APPLICATION INFORMATION Ramp control PA protection against mismatch Detected voltage measurement Application examples 13 14 14.1 14.2 14.3 14.4 14.5 15 15.1 15.2 15.2.1 15.2.2 15.2.3 15.2.4 15.2.5 16 17 18 PACKAGE OUTLINES SOLDERING (TSSOP10) PCF5079 Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING (HVSON10) Soldering information PCB design guidelines Perimeter pad design Thermal pad and via design Stencil design for perimeter pads Stencil design for thermal pads Stencil thickness DATA SHEET STATUS DEFINITIONS DISCLAIMERS 2001 Nov 21 2 Philips Semiconductors Product specification Dual-band power amplifier controller for GSM, PCN and DCS 1
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