PCF5079
Description
to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING (HVSON10) Soldering information PCB design guidelines Perimeter pad design Thermal pad and via design Stencil design for perimeter pads Stencil design for thermal pads Stencil thickness DATA SHEET STATUS DEFINITIONS DISCLAIMERS 2001 Nov 21 2 Philips Semiconductors Product specification Dual-band power amplifier controller for GSM, PCN and DCS.
