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NXP Semiconductors Electronic Components Datasheet

PCF50732 Datasheet

Baseband and audio interface for GSM

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INTEGRATED CIRCUITS
DATA SHEET
PCF50732
Baseband and audio interface for
GSM
Objective speciļ¬cation
File under Integrated Circuits, IC17
1999 May 03


NXP Semiconductors Electronic Components Datasheet

PCF50732 Datasheet

Baseband and audio interface for GSM

No Preview Available !

Philips Semiconductors
Baseband and audio interface for GSM
Objective speciļ¬cation
PCF50732
CONTENTS
1
2
3
4
5
6
7
8
8.1
8.2
9
9.1
9.2
9.3
10
10.1
10.2
10.3
11
11.1
11.2
11.3
11.4
12
12.1
12.2
12.3
13
13.1
13.2
13.3
13.4
FEATURES
APPLICATIONS
GENERAL DESCRIPTION
ORDERING INFORMATION
QUICK REFERENCE DATA
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
General
Baseband and voice band reference voltages
BASEBAND CODEC
Baseband transmit path
Baseband receive path
Baseband Serial Interface (BSI)
VOICE BAND CODEC
Voice band receive path
Voice band transmit path
Voice band digital circuitry
AUXILIARY FUNCTIONS
Automatic Gain Control (AGC): AUXDAC1
Automatic Frequency Control (AFC):
AUXDAC2
Power ramping: AUXDAC3
Auxiliary analog-to-digital converter (AUXADC)
CONTROL SERIAL INTERFACE (CSI)
The serial interface
Control Serial Interface (CSI) timing
characteristics
Control register block
VOICE BAND SIGNAL PROCESSOR (VSP)
Hardware description
VSP assembler language
Descriptions of the VSP instruction set
The assembler/emulator
14
15
16
17
18
18.1
18.2
18.3
18.4
18.5
18.6
18.7
18.8
19
19.1
19.2
20
21
21.1
21.2
21.3
21.4
21.5
22
23
LIMITING VALUES
THERMAL CHARACTERISTICS
DC CHARACTERISTICS
AC CHARACTERISTICS
FUNCTIONAL CHARACTERISTICS
Baseband transmit (BSI to TXI/Q)
Baseband receive (RXI/Q to BSI)
Voice band transmit (microphone to ASI)
Voice band receive (ASI to earphone)
Auxiliary digital-to-analog converters
Auxiliary analog-to-digital converters:
AUXADC1, AUXADC2, AUXADC3 and
AUXADC4
Typical total current consumption
Typical output loads
APPLICATION INFORMATION
Wake-up procedure from Sleep mode
Microphone input connection and test set-up
PACKAGE OUTLINES
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DEFINITIONS
LIFE SUPPORT APPLICATIONS
1999 May 03
2


Part Number PCF50732
Description Baseband and audio interface for GSM
Maker NXP
PDF Download

PCF50732 Datasheet PDF






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