Datasheet Details
| Part number | PCF50732 |
|---|---|
| Manufacturer | NXP Semiconductors |
| File Size | 322.52 KB |
| Description | Baseband and audio interface |
| Download | PCF50732 Download (PDF) |
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| Part number | PCF50732 |
|---|---|
| Manufacturer | NXP Semiconductors |
| File Size | 322.52 KB |
| Description | Baseband and audio interface |
| Download | PCF50732 Download (PDF) |
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ORDERING INFORMATION QUICK REFERENCE DATA BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION General Baseband and voice band reference voltages BASEBAND CODEC Baseband transmit path Baseband receive path Baseband Serial Interface (BSI) VOICE BAND CODEC Voice band receive path Voice band transmit path Voice band digital circuitry AUXILIARY FUNCTIONS Automatic Gain Control (AGC): AUXDAC1 Automatic Frequency Control (AFC): AUXDAC2 Power ramping: AUXDAC3 Auxiliary analog-to-digital converter (AUXADC) CONTROL SERIAL INTERFACE (CSI) The serial interface Control Serial Interface (CSI) timing characteristics Control register block VOICE BAND SIGNAL PROCESSOR (VSP) Hardware description VSP assembler language Descriptions of the VSP instruction set The assembler/emulator 14 15 16 17 18 18.1 18.2 18.3 18.4 18.5 18.6 LIMITING VALUES PCF50732 THERMAL CHARACTERISTICS DC CHARACTERISTICS AC CHARACTERISTICS FUNCTIONAL CHARACTERISTICS Baseband transmit (BSI to TXI/Q) Baseband receive (RXI/Q to BSI) Voice band transmit (microphone to ASI) Voice band receive (ASI to earphone) Auxiliary digital-to-analog converters Auxiliary analog-to-digital converters: AUXADC1, AUXADC2, AUXADC3 and AUXADC4 Typical total current consumption Typical output loads APPLICATION INFORMATION Wake-up procedure from Sleep mode Microphone input connection and test set-up PACKAGE OUTLINES SOLDERING Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods DEFINITIONS LIFE SUPPORT APPLICATIONS 18.7 1
INTEGRATED CIRCUITS DATA SHEET PCF50732 Baseband and audio interface for GSM Objective speciļ¬cation File under Integrated Circuits, IC17 1999 May 03 Philips Semiconductors Objective speciļ¬cation Baseband and audio interface for GSM CONTENTS 1 2 3 4 5 6 7 8 8.1 8.2 9 9.1 9.2 9.3 10 10.1 10.2 10.3 11 11.1 11.2 11.3 11.4 12 12.1 12.2 12.3 13 13.1 13.2 13.3 13.
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