Datasheet4U Logo Datasheet4U.com

PBSS4260QA - NPN low VCEsat (BISS) transistor

General Description

NPN low VCEsat Breakthrough In Small Signal (BISS) transistor in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.

PNP complement: PBSS5260QA.

2.

Key Features

  • Very low collector-emitter saturation voltage VCEsat High collector current capability IC and ICM High collector current gain hFE at high IC High energy efficiency due to less heat generation Reduced Printed-Circuit Board (PCB) area requirements Solderable side pads AEC-Q101 qualified 3.

📥 Download Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
PBSS4260PAN 2A NPN/NPN low VCEsat (BISS) transistor nexperia
PBSS4260PANP 2A NPN/PNP low VCEsat (BISS) transistor nexperia
PBSS4260PANPS NPN/PNP Transistor nexperia
PBSS4260PANS NPN/NPN Transistor nexperia
PBSS4220PANS NPN/NPN Transistor nexperia

Other Datasheets by NXP Semiconductors

Part Number Description
PBSS4260PAN NPN/NPN low VCEsat (BISS) transistor
PBSS4260PANP NPN/NPN low VCEsat (BISS) transistor
PBSS4220V 2A NPN low VCEsat (BISS) transistor
PBSS4230PAN NPN/NPN low VCEsat (BISS) transistor
PBSS4230PANP NPN/PNP low VCEsat (BISS) transistor

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
DF N1 01 PBSS4260QA 28 August 2013 0D -3 60 V, 2 A NPN low VCEsat (BISS) transistor Product data sheet 1. General description NPN low VCEsat Breakthrough In Small Signal (BISS) transistor in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads. PNP complement: PBSS5260QA. 2. Features and benefits • • • • • • • Very low collector-emitter saturation voltage VCEsat High collector current capability IC and ICM High collector current gain hFE at high IC High energy efficiency due to less heat generation Reduced Printed-Circuit Board (PCB) area requirements Solderable side pads AEC-Q101 qualified 3. Applications • • • • • Loadswitch Battery-driven devices Power management Charging circuits Power switches (e.g.