• Part: NVT4857UK
  • Description: memory card voltage level translator
  • Manufacturer: NXP Semiconductors
  • Size: 637.48 KB
Download NVT4857UK Datasheet PDF
NXP Semiconductors
NVT4857UK
NVT4857UK is memory card voltage level translator manufactured by NXP Semiconductors.
description The device is an SD 3.0-pliant bidirectional dual voltage level translator with auto-direction control. It is designed to interface between a memory card operating at 1.8 V or 3.0 V signal levels and a host with a nominal supply voltage of 1.2 V to 1.8 V. The device supports SD 3.0 SDR104, SDR50, DDR50, SDR25, SDR12 and SD 2.0 High-Speed (50 MHz) and Default-Speed (25 MHz) modes. The device has an integrated voltage selectable low dropout regulator to supply the card-side I/Os, an auto-enable/ disable function connected to the VSD supply pin, built-in EMI filters and robust ESD protections (IEC 61000-4-2, level 4). 2. Features and benefits - Supports up to 208 MHz clock rate - SD 3.0 specification-pliant voltage translation to support SDR104, SDR50, DDR50, SDR25, SDR12, High-Speed and Default-Speed modes - 1.2 V to 1.8 V host side interface voltage support - Feedback channel for clock synchronization - 100 m A Low dropout voltage regulator to supply the card-side I/Os - Low power consumption by push-pull output stage with break-before-make architecture - Automatic enable and disable through VSD - Integrated pull-up and pull-down resistors: no external resistors required - Integrated EMI filters suppress higher harmonics of digital I/Os - Integrated 8 k V ESD protection according to IEC 61000-4-2, level 4 on card side - Level shifting buffers keep ESD stress away from the host (zero-clamping concept) - 20-ball WLCSP; pitch 0.4 mm 3. Applications - Smart phones - Mobile handsets - Digital cameras - Tablet PCs - Laptop puters - SD, MMC or micro SD card readers NXP Semiconductors SD 3.0 - SDR104 auto-direction control memory card level translator 4. Ordering information Table 1. Ordering information Type number Topside mark Package Name NVT4857UK N4857 WLCSP20 Description wafer level chip-size package; 20 bumps (5  4), size 1.7 x 2.1 x 0.49 mm, 0.4 mm pitch Version NVT4857 4.1 Ordering options Table 2. Ordering options Type number...