NXP Semiconductors
Data Sheet: Technical Data
Document Number: IMXRT1050CEC
Rev. 1.3, 03/2019
i.MX RT1050 Crossover
Processors Data Sheet
for Consumer Products
MIMXRT1051DVL6A
MIMXRT1051DVL6B
MIMXRT1051DVJ6B
MIMXRT1052DVL6A
MIMXRT1052DVL6B
MIMXRT1052DVJ6B
Package Information
Plastic Package
196-pin MAPBGA, 10 x 10 mm, 0.65 mm pitch
196-pin MAPBGA, 12 x 12 mm, 0.8 mm pitch
Ordering Information
1 i.MX RT1050 introduction
See Table 1 on page 5
The i.MX RT1050 is a new processor family featuring 1. i.MX RT1050 introduction . . . . . . . . . . . . . . . . . . . . . . . . 1
NXP’s advanced implementation of the Arm
Cortex®-M7 core, which operates at speeds up to 600
MHz to provide high CPU performance and best
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 5
2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
real-time response.
3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1. Special signal considerations . . . . . . . . . . . . . . . 15
The i.MX RT1050 processor has 512 KB on-chip RAM,
3.2. Recommended connections for unused analog
interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
which can be flexibly configured as TCM or
4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 18
general-purpose on-chip RAM. The i.MX RT1050
integrates advanced power management module with
4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 18
4.2. System power and clocks . . . . . . . . . . . . . . . . . . 25
4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 30
DCDC and LDO that reduces complexity of external
power supply and simplifies power sequencing. The
i.MX RT1050 also provides various memory interfaces,
4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 36
4.5. External memory interface . . . . . . . . . . . . . . . . . 41
4.6. Display and graphics . . . . . . . . . . . . . . . . . . . . . . 51
4.7. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
including SDRAM, RAW NAND FLASH, NOR
FLASH, SD/eMMC, Quad SPI, and a wide range of
4.8. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
4.9. Communication interfaces . . . . . . . . . . . . . . . . . . 64
4.10. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
other interfaces for connecting peripherals, such as
5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 79
WLAN, Bluetooth™, GPS, displays, and camera
5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 79
5.2. Boot device interface allocation . . . . . . . . . . . . . . 79
sensors. The i.MX RT1050 also has rich audio and video 6. Package information and contact assignments . . . . . . . 84
features, including LCD display, basic 2D graphics,
camera interface, SPDIF, and I2S audio interface. The
6.1. 10 x 10 mm package information . . . . . . . . . . . . 84
6.2. 12 x 12 mm package information . . . . . . . . . . . . 96
7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
NXP reserves the right to change the production detail specifications as may be required
to permit improvements in the design of its products.
