LPC3143
Description
Version LPC3141FET180 TFBGA180 Plastic thin fine pitch ball grid array package, 180 balls, body 12 12 0.8 mm SOT570-3 LPC3143FET180 TFBGA180 Plastic thin fine pitch ball grid array package, 180 balls, body 12 12 0.8 mm SOT570-3 3.1 Ordering options Table 2.
Key Features
- and benefits
- CPU platform 270 MHz, 32-bit ARM926EJ-S 16 kB D-cache and 16 kB I-cache Memory Management Unit (MMU)
- Internal memory 192 kB embedded SRAM
- System functions Dynamic clock gating and scaling Multiple power domains
- Operating voltage and temperature Core voltage: 1.2 V I/O voltages: 1.8 V, 3.3 V Temperature: 40 C to +85 C
