BYV25FD-600 Datasheet, NXP

* High thermal cycling performance
* Low on-state losses
* Low thermal resistance
* Soft recovery characteristic
* Surface-mountable package 1.3 App.

* Dual Mode (DCM and CCM) PFC
* Power Factor Correction (PFC) for Interleaved Topology 1.4 Quick reference dat.

Enhanced ultrafast power diode in a SOT428 (DPAK) plastic package. 1.2 Features and benefits
* High thermal cycling performance
* Low on-state losses
* Low thermal resistance
* Soft recovery characteristic
* Surface-mountable pa.

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