BYV10ED-600P Datasheet, NXP

* High thermal cycling performance
* Soft recovery characteristic
* Low on-state losses
* Surface-mountable package
* Low thermal resistance
* Enh.

* Dual Mode (DCM and CCM) PFC
* Power Factor Correction (PFC) for Interleaved Topology 4. Quick reference data .

Enhanced ultrafast power diode in a SOT428 (DPAK) plastic package. 2. Features and benefits
* High thermal cycling performance
* Soft recovery characteristic
* Low on-state losses
* Surface-mountable package
* Low thermal resista.

BYV10EX-600P

BYV10

BYV10-20

BYV10-30

BYV10-40

BYV10-60

BYV10-600P

BYV10D-600P

BYV10X-600P

BYV1100

BYV116

BYV116-20

BYV116-25