BUJ303AD Datasheet (PDF) Download
NXP Semiconductors
BUJ303AD

Description

plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped) Version SOT428 Table 4.

Key Features

  • Fast switching
  • Low - Surface mountable package
  • Very high voltage capability
  • Very low switching and conduction losses 1.3 Applications
  • DC-to-DC converters
  • High frequency electronic lighting ballasts
  • Motor control systems 1.4 Quick reference data Table