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BCP55 - NPN medium power transistors

Description

NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages.

Table 1.

[1] Valid for all available selection groups.

Features

  • High current.
  • Three current gain selections.
  • High power dissipation capability.
  • Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061).
  • Leadless very small SMD plastic package with medium power capability (SOT1061).
  • AEC-Q101 qualified 1.3.

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Datasheet preview – BCP55

Datasheet Details

Part number BCP55
Manufacturer NXP
File Size 397.06 KB
Description NPN medium power transistors
Datasheet download datasheet BCP55 Datasheet
Additional preview pages of the BCP55 datasheet.

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Full PDF Text Transcription

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BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors Rev. 8 — 24 October 2011 Product data sheet 1. Product profile 1.1 General description NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages. Table 1. Product overview Type number[1] Package NXP BCP55 SOT223 BCX55 SOT89 BC55PA SOT1061 JEITA SC-73 SC-62 - [1] Valid for all available selection groups. JEDEC TO-243 - PNP complement BCP52 BCX52 BC52PA 1.2 Features and benefits  High current  Three current gain selections  High power dissipation capability  Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)  Leadless very small SMD plastic package with medium power capability (SOT1061)  AEC-Q101 qualified 1.
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