Ceramics （） Silicone Resin(with phosphor) Au-plated Silicone Resin Au-plated 0.031g(TYP) KA Die Heat Sink Protection Device 5 0.4 1.2 1.9 3.3 0.5 SOLDERING
* Recommended Reflow Soldering Condition(Lead-free Solder) 1 to 5°C per sec .

NVSL219BT-V1

NVSL119CT

NVSLE21AT

NVS0.3CH-M6

NVS0.3CJ-M6

NVS0.3EH-M6

NVS0.3EJ-M6

NVS0.4YJ-M6

NVS0.4ZJ-M6

NVS0.5YH-M6

NVS0.5ZH-M6

NVS0.7CG-M6

NVS0.7EG-M6

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