Package Materials Encapsulating Resin Materials Electrodes Materials Weight Ceramics （+） Silicone Resin (with diffuser and phosphor) Au-plated 0.80g(TYP) KA Protection Device 4 SOLDERING NICHIA STS-DA1-3093B
* Recom.

NTC- 3D -15x

NTC- 5D -15x

NTC- 8D -15x

NTC-0.7D20

NTC-0.7D22

NTC-0.7D25

NTC-1.3D13

NTC-1.3D15

NTC-1.3D20

NTC-1.3D22

NTC-1.5D13

NTC-1.5D15

NTC-1.5D25

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